| abstract |
(57) [Summary] [Object] To provide a structural adhesive composition capable of forming an adhesive layer which is strong, heat resistant, has less sink marks and excellent green strength. [Structure] The structural adhesive composition comprises an epoxy compound, It is composed of an amine curing agent and a hydroxy-substituted aromatic compound having a pKa of 5 to 9.7 and a boiling point of 210 ° C. or higher. The use of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the above range provides an adhesive composition which exhibits excellent green strength, has less sink marks during the adhesion and curing steps, and can withstand high temperature conditions. |