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filingDate 1993-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c073546f2eefd5a0962402278fa29e6
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publicationDate 1994-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06204361-A
titleOfInvention Epoxy resin composition for semiconductor device encapsulation
abstract (57) [Summary] [Structure] (A) Epoxy resin; (B) Phenolic resin curing agent; (C) Curing accelerator; (D) Average particle size 3 to 10 A crushed silica powder having a particle size of 0 μm; and (E) a spherical silica powder having an average particle size of 1 to 50 μm, wherein (E) is 5 to 30% by volume with respect to the total amount of (D) and (E). , (D) and (E) have a particle size ratio of 1 for the latter and 3 or more for the former, and the total amount of (D) and (E) is (A), (B), ( An epoxy resin composition for semiconductor device encapsulation, which is 50 to 75% by volume with respect to the total compounding amount of C), (D) and (E). [Effect] A cured product having good moldability and excellent thermal shock resistance and moisture resistance is provided.
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