| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1992-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43a0ac9627f39fb4aaf5c5f56ce49479
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_864d188d11c29831809137e0c5e37744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_818fd76a083be77dcdccf570cfe6cf30 |
| publicationDate |
1994-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06204264-A |
| titleOfInvention |
Resin-sealed semiconductor device |
| abstract |
(57) [Summary] [Structure] A semiconductor device having an insulating resin film on a circuit surface is attached to a lead frame via a film adhesive, and this is sealed with a sealing resin. A resin-encapsulated semiconductor device, wherein the elastic modulus and linear expansion coefficient of the linear adhesive, and the elastic modulus of the encapsulating resin satisfy the following relationships. (A-3 × C) × B + 150 × C <5000 where A: linear expansion coefficient of adhesive at 240 ° C. (pp m) B: Elastic modulus of adhesive at 240 ° C (MPa) C: Elastic modulus of sealing resin at 240 ° C (MPa) [Effect] No package cracks occur during solder reflow processing, and pressure cooker test and humidification heating processing It is possible to provide a highly reliable resin-sealed semiconductor device that does not cause delamination at times. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7781896-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6717242-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6825249-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7078094-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6621170-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6855579-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1032036-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7012320-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7057265-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1235276-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7387914-B2 |
| priorityDate |
1992-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |