| abstract |
(57) [Abstract] [Purpose] In wet oxidation treatment using a vertical heat treatment apparatus (vertical diffusion furnace) in the manufacture of semiconductor devices, even if a corrosive chemical such as hydrochloric acid is used and steam is used. (EN) Provided is a heat treatment apparatus capable of forming a clean wet oxide film, which does not generate a liquefied liquid pool and further satisfies the heat resistance performance of an O-ring for keeping airtightness. In a semiconductor heat treatment apparatus having a heating part having a furnace opening for loading and unloading a wafer, a jig for holding a wafer, and a sealing flange for fixing the jig and sealing the furnace opening, A heating unit capable of controlling the temperature and a heating unit capable of controlling the water temperature of the sealing flange cooling water are provided, and a control unit is provided at the same time. [Effect] The vertical heat treatment apparatus has conventionally been capable of performing only dry oxidization treatment, but now wet oxidization treatment is possible and it becomes possible to form a clean wet oxide film. |