| abstract |
(57) [Summary] [Structure] General formula (1) (In the formula, n is 0 to 10, X is a divalent organic group, at least one of P is an alkyl group having 4 to 10 carbon atoms, and i is 1 to 4 Represents ) An epoxy resin composition containing an epoxy compound represented by the formula (1) and a polybutadiene compound modified with a phenolic compound as essential components, and a copper-clad laminate obtained from the epoxy resin composition. [Effect] The epoxy resin composition of the present invention provides a copper-clad laminate having low dielectric properties, excellent water resistance, heat resistance and adhesiveness. |