http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06196535-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 1991-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_703019786fedd4f7d2ad6f26d7b2ea0d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b554d313c18a129dfa08095f7e85b01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2699a9c0efbe6527a18382a2a2d1031e |
| publicationDate | 1994-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06196535-A |
| titleOfInvention | Semiconductor element inspection apparatus and manufacturing method thereof |
| abstract | (57) [Summary] [Object] The present invention relates to a technique for enlarging a simple wiring pattern for connecting a high-density multi-pin probe terminal of a semiconductor device inspection apparatus to an inspection circuit. [Structure] FIG. 1 shows a cross-sectional view of a main part of a semiconductor device inspection apparatus. The present invention provides a method of expanding a wiring pattern for connecting a high-density multi-pin movable spring probe terminal 27 to an inspection circuit by preparing an insulating substrate 20 that has been punched, and at one end of a conductive tube 25, the insulating substrate 20 is insulated. An electrode 26 having a diameter slightly larger than the hole diameter of the substrate 20 is formed, and the wiring having the tip 24 of the wire material for the lead wiring fixed to the other end is individually inserted into the hole of the insulating substrate 20 and then fixed with an adhesive 28. Then, the electrode 26 was brought into contact with the probe terminal 27 to form a semiconductor device inspection apparatus. [Effect] According to the present invention, the structure is simple, the assembly is easy, It is possible to provide a wiring expansion board which can deal with pattern changes only by drilling and can be designed and manufactured in a short period of time, and a semiconductor device inspection apparatus using the same. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6535010-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0016106-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109613307-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101455540-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170002895-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100647494-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190029662-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100291940-B1 |
| priorityDate | 1991-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.