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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
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filingDate 1992-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cae4703e4d9f59b4ad4a1f80264c0ec
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publicationDate 1994-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06192394-A
titleOfInvention Low shrinkage thermosetting resin composition and adhesive using the same
abstract (57) [Summary] (Modified) [Purpose] Use of a resin composition that has less heat shrinkage during curing and is excellent in heat resistance without using fillers and additives such as non-reactive resins, and uses it. To provide an adhesive having excellent heat resistance. [Structure] A thermosetting resin composition in which the mixing ratio of the component (a) and the component (b) is (a) / (b) = 90/10 to 10/90 in parts by weight, and It is an adhesive containing this thermosetting resin composition. Here, (a) is bisphenol fluorange glycidyl ether and its oligomer, and (b) is an epoxy resin other than the above-mentioned component (a) which is liquid at room temperature and has two or more oxirane groups in one molecule. Further, it further contains at least one of an acid anhydride type curing agent, an amine type curing agent and an amide type curing agent, and also has a curing accelerator.
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