| abstract |
(57) [Summary] [PROBLEMS] To provide a photosensitive resin composition useful as a solder resist for a printed wiring board or the like, which is hardened by ultraviolet rays and can be washed with water or a dilute aqueous alkali solution. [Structure] [Chemical 1] (A) Epoxy compound of an epoxy resin having a triazine ring represented by Chemical formula 1 and an unsaturated monocarboxylic acid 10 to 40% by weight, (B) 10 to 50% by weight of a reactive diluent having a double bond containing 10% by weight or more of a water-soluble reactive diluent, (C) a phosphorus-containing unsaturated carboxylic acid derivative represented by Chemical formula 2. [Chemical 2] [In the formula, R 1 represents a hydrogen atom or a methyl group, R 2 represents an alkylene group, and a and b represent 1 or 2. ] (D) Photopolymerization initiator 0.1 to 1 A photosensitive resin composition comprising 0.0% by weight. |