http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06184439-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 1992-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c821969b67a1c4d1983a7c687e70832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fc688915e4d9d3858a7e870ad357099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1512e632b2dd75442d3e4f65473c85eb |
| publicationDate | 1994-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06184439-A |
| titleOfInvention | High adhesion polyimide resin composition |
| abstract | (57) [Summary] [Structure] 1,3-bis (3-aminopropyl) -1, 0.03 mol of 1,3,3-tetramethyldisiloxane, 0.94 mol of 4,4'-oxydianiline was dissolved in a solvent, and then 0.50 mol of 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride and 0.50 of pyromellitic dianhydride. After adding the moles, react at 80 ° C. for 3 hours, It is a polyamic acid composition obtained by adding 20 parts by weight of trimethoxysilylpropyl methacrylate to 100 parts by weight of the solid content of the obtained polyamic acid. [Effect] Not only the adhesion to the substrate such as Si but also the adhesion to the epoxy-based encapsulating material can be improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014511357-A |
| priorityDate | 1992-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.