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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-48
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filingDate 1992-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ec65804125d99efba8f52b7bc775f21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba335db5d1ab8e82ec1ae59bbce8d285
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publicationDate 1994-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06179737-A
titleOfInvention High heat resistant epoxy resin composition
abstract (57) [Summary] [Structure] 10 to 150 parts by weight of a bisphenol-based epoxy resin which is liquid at room temperature per 100 parts by weight of tris (2,3-epoxypropyl) isocyanurate, and polycarboxylic acid anhydride to all epoxy groups. 0.7 to 1.1 equivalents, A resin composition obtained by blending 0.1 to 5 parts by weight of a curing accelerator with respect to all epoxy groups, and curing the composition to an epoxy group reaction rate of 95% or more and an acid anhydride group reaction rate of 95% or more. The present invention relates to a method for curing a resin composition to be reacted. [Effect] The epoxy resin composition obtained by the present invention has excellent storage stability and good workability for curing, and the obtained cured product has heat resistance and good electrical characteristics at high temperatures, and has low water absorption. It is sex.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8803159-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012238857-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5422121-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9034671-B2
priorityDate 1992-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 52.