http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06179736-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 1992-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d8bdadb15248026e854a64972c74eba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa8f94b507075ac7e610a0fda1eee0d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39aed00c662b754c88004ae13373502f |
| publicationDate | 1994-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06179736-A |
| titleOfInvention | Liquid epoxy resin composition for semiconductor encapsulation and method for producing the same |
| abstract | (57) [Summary] (Modified) [Structure] Epoxy resin (A), curing agent (B), filler (C), silane coupling agent (D) and solvent (E) A liquid epoxy resin composition comprising: the epoxy resin (A), wherein the epoxy resin (A) is a biphenyl type epoxy resin (a). As an essential component, the curing agent (B) contains a biphenol compound (b) as an essential component, and the solvent (E) is 5 to 30 wt% of the entire liquid epoxy resin composition. The residual component accounts for 70 to 95% by weight, the proportion of the filler (C) is 75 to 95% by weight of the residual component, and the proportion of the silane coupling agent (D) is the residual component. A liquid epoxy resin composition for semiconductor encapsulation of 0.3 to 3.0% by weight and a method for producing the same. [Effect] It is excellent in moist heat resistance, temperature cycle resistance reliability and workability, especially in preventing sedimentation of solids. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06287273-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8242216-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7999042-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012282462-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4595194-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8431223-B2 |
| priorityDate | 1992-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.