| abstract |
(57) [Summary] [Object] Since the heat-resistant adhesive composition of the present invention forms a laminate with the solution composition, metal foil, heat-resistant film, sheet, etc. can be easily stretched at a relatively low temperature. It can be matched and bonded, and has excellent heat resistance, flexibility, and adhesiveness even after bonding and curing, and is suitable as an adhesive for flexible wiring boards, copper-clad boards for TAB, and the like. [Structure] Soluble polyimidesiloxane obtained from an aromatic tetracarboxylic acid component containing biphenyltetracarboxylic acid as a main component and a diamine component containing diaminopolysiloxane and aromatic diamine, an epoxy-modified polysiloxane, and another epoxy group-containing epoxy group. A heat-resistant adhesive composition obtained by laminating at least two kinds of the above-mentioned compositions in which the kind and / or the content ratio of each component of the heat-resistant adhesive composition comprising an epoxy compound and an epoxy curing agent are laminated. |