| abstract |
(57) [Abstract] [Purpose] To provide a semiconductor device resin-encapsulated with an encapsulating resin having excellent moisture resistance reliability, heat resistance reliability, and mechanical strength. A semiconductor device is obtained by sealing a semiconductor element with a maleimide compound as a main component, a phenol compound as a curing agent for the maleimide compound, a vinylbenzyl compound, and a resin composition preferably containing a curing catalyst. |