| abstract |
(57) [Summary] (Correction) [Purpose] High productivity, standardization is possible, Enables wire bonding with excellent bondability. [Structure] Upper electrode 21 of semiconductor chip 20 mounted on substrate 10 of hybrid integrated circuit and electrode 1 for circuit wiring on substrate Wire bonding between 1 and 1. At this time, a chip-shaped body 30 having an electrode conductor made of a material (gold in the case of a gold wire, aluminum or nickel in the case of an aluminum wire) having good bondability with the wire 40 formed on the surface is used. The body 30 is fixed on the circuit wiring electrode 11, and then the electrode conductor of the chip-shaped body 30 and the upper electrode 21 of the semiconductor chip 20 are joined by wire bonding. Further, in the chip-shaped body 30, for example, electrode portions 32 are formed on both ends of a substantially cubic insulating substrate 31, and electrode conductors 33 made of a material having a good bondability with a wire are formed thereon. |