| abstract |
(57) [Summary] (Modified) [Objective] To provide a resin-encapsulated semiconductor device having excellent solder reflow crack resistance of the package and moisture resistance reliability after the reflow treatment. In a resin-sealed semiconductor device in which a semiconductor element and a part of a lead frame 4 are resin-sealed 6, an adhesive layer 8 for fixing the semiconductor element to a die pad portion is a curing agent that is liquid at room temperature represented by the following chemical formula. And an epoxy resin composition containing the phenol compound as an essential component. (However, · R: -CH 2 -, - (CH 2) 2 -, C (C H 3) 2 -, - CH (CH 3) -, · n and m are each 0 or 1. ) |