abstract |
(57) [Summary] [Structure] The structural unit represented by the following general formula (1) is 10 A photosensitive resin composition comprising a high molecular weight copolymer and a photoinitiator. [Chemical 29] (In the formula, R 1 is an organic residue having an aromatic ring and having 6 to 15 carbon atoms, R 2 is hydrogen, a phenyl group, an alkoxyphenyl group, R 3 , R 4 and R 5 represent hydrogen or an alkyl group having 9 or less carbon atoms, and at least two of R 3 , R 4 and R 5 are hydrogen. [Effect] A photosensitive resin composition having excellent heat resistance after curing is obtained, and the present material can provide a multilayer wiring board having fine wiring. |