| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18 |
| filingDate |
1992-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d973e3d33b994124810fdd9d6b00b9cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d9b6b0e1a160945ebdfdc2f870e2779
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aac5662889eb0c0d390e920399bb5d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43ca58667362f74700b7b4e49f5bbc55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7c4e4231d125f3446eef4963f6209a0 |
| publicationDate |
1994-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06145986-A |
| titleOfInvention |
Copper film forming material |
| abstract |
(57) [Summary] [Purpose] To provide high-purity copper film forming materials. [Structure] Formula [Chemical Formula 1] The compound can achieve the object. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8263795-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7205422-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7034169-B1 |
| priorityDate |
1992-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |