| abstract |
(57) [Summary] [Purpose] A liquid epoxy resin that has a low viscosity and good workability, and also gives a cured product with a low volatile content and excellent moisture resistance and heat resistance, and is suitable as a liquid sealing agent for semiconductors. Obtain the composition. [Structure] An epoxy resin represented by the following general formula (1) is mixed in an amount of 5% by weight or more in all epoxy resins, and a viscosity at 25 ° C. in a BH type viscometer is 10,000 poise or less. [Chemical 1] (In the formula, R is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.) |