http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06145259-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1992-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_082769664972dd9b0248dc1d23b72a9e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a5c8be8333be3df695696ac631d2eae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb4e6ba433f7b67bf1e7f69be9e7da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad0cd7ce5c40fe7554ef392baa27491 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bfe856f9510de9b94a97fcbeac65344 |
| publicationDate | 1994-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06145259-A |
| titleOfInvention | Thermosetting resin composition and use thereof |
| abstract | (57) [Summary]n[Purpose] The cured product has excellent moisture resistance, adhesiveness and heat resistance. Provided is a polyimide-based thermosetting resin composition.n[Structure] (A) General formula (I)n[Chemical 1]n (In the formula, R 1 Is a halogen atom, an alkoxy group having 4 or less carbon atoms Si group, substituted or unsubstituted phenyl group having 10 or less carbon atoms Or an alkyl group having 6 or less carbon atoms and R 1 Is compound If there are several, they may be the same or different Yes. R 2 Is a hydrogen atom or an alkyl group having 4 or less carbon atoms Show and R 2 May be the same or different from each other Good. R 3 Represents an alkyl group having 6 or less carbon atoms, and R 3 Are different from each other even if they are the same May be. m and n each represent an integer of 0 to 4 You D is a polymerizable unsaturated double bond having 2 to 24 carbon atoms The divalent organic group is shown. ) An imide compound represented by And (B) curing accelerator or these and (C) epoxy Thermosetting with resin and (D) epoxy curing agent as essential components Resin composition and electronic part sealed by using the same Goods etc. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011219674-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106674027-A |
| priorityDate | 1992-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 225.