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filingDate 1992-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e10d51bfa1cd5f83669b1bc64a1c2f73
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publicationDate 1994-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06145051-A
titleOfInvention Patch for pre-puncture application and method for reducing pain during puncture
abstract (57) [Summary] [Structure] A flexible carrier and a pressure-sensitive adhesive layer containing 40 to 65% of a local anesthetic provided on the carrier, which is contained in the pressure-sensitive adhesive layer. The ratio of the undissolved amount (Ac) and the dissolved amount (As) of the local anesthetic used is Ac / As = 0.1 to 1.8, and a patch used for reducing pain on puncture and a method for reducing pain on puncture using the patch. [Effect] The patch is excellent in self-adhesiveness and has less adhesive residue. In particular, the undissolved local anesthetic in the pressure-sensitive adhesive layer is released as a burst immediately after application, so that an anesthetic effect is exhibited in a short time. Therefore, by applying the patch to the skin at the planned puncture site before the treatment, the pain during the puncture treatment can be significantly reduced.
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