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filingDate 1992-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1994-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06143476-A
titleOfInvention Low deformation aramid board
abstract (57) [Abstract] [Purpose] To provide an electrically insulating heat-resistant aramid board having a small dimensional change due to moisture absorption and good thermal conductivity. [Structure] A sheet (A) consisting essentially of m-aramid fibrids and m-aramid fibers, and a sheet (B) consisting essentially of m-aramid fibrids and p-aramid fibers, glass fibers or granular mica. Are laminated so that the moisture content of each sheet is adjusted to less than 45%, and at least one sheet (A) is interposed between each layer of the sheet (B), and they are heated and pressed to be integrated. Aramid board.
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