http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06140506-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F17-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-82 |
| filingDate | 1992-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de3a7f233a64736e180bdc5a2eea0b70 |
| publicationDate | 1994-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H06140506-A |
| titleOfInvention | Wiring method for semiconductor integrated circuits |
| abstract | (57) [Abstract] [Purpose] To reduce the number of through holes to improve the yield in the manufacture of integrated circuits and to reduce the chip area. [Composition] In connecting the terminals 9 of the functional blocks 5A and 5B, the step before the through-hole reduction process is to connect the wiring line segment 6A of the first aluminum wiring layer from the wiring pattern already formed and to the end thereof. Hit through hole 8A. Further, the wiring line segment 7 of the second aluminum wiring layer is wired, and the through hole 8B is formed at the end thereof. After that, the wiring line segment 6B of the first aluminum wiring layer is wired and the functional block 5B of the other party is wired. Connected to the terminal 9. Then, in the wiring replacement step, the first wiring line segment 7 is connected between the through holes 8A and 8B. Replace with the wiring line segment 6C of the aluminum wiring layer. Finally, Through hole removal processing allows through holes 8A, 8A Delete B. |
| priorityDate | 1992-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.