| abstract |
(57) [Abstract] [Purpose] To provide a semiconductor device having high reliability with excellent characteristics of solder crack resistance, moisture resistance reliability, heat resistance reliability, and mechanical strength. [Structure] A resin composition containing the following components (A) to (D), wherein the alkenyl group of the component (B) is set to 0.05 to 0.7 equivalents relative to one equivalent of the maleimide group of the component (A). The object is used to seal the semiconductor element. (A) A maleimide compound having two or more maleimide groups in one molecule, wherein: A maleimide compound containing 50% by weight or more of 2,2-bis [4- (4-maleimidophenoxy) phenyl] propane. (B) At least one of an alkenylphenol compound and an alkenylphenol ether compound. (C) Inorganic filler. (D) Curing catalyst. |