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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
filingDate 1992-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5396b50a812a5bad846954e424cc8c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c05d64bd7f2a0107dbcf7d2071085db
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publicationDate 1994-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06128360-A
titleOfInvention Liquid epoxy resin composition
abstract (57) [Summary] [Purpose] To provide a liquid epoxy resin composition having a low viscosity, which can provide a highly reliable cured product having excellent adhesiveness, adhesion, water resistance, electrical characteristics, heat resistance and the like. provide. [Structure] An epoxy resin having two or more epoxy groups in one molecule, a liquid epoxy resin at room temperature, and three or more phenolic hydroxyl groups in one molecule, and having a phenolic hydroxyl group equivalent of 60. A phenolic curing agent composed of the following aromatic compounds is included as an essential component.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104428340-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016117802-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020209327-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014007068-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007086324-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8084650-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014007068-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150035769-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011148911-A
priorityDate 1992-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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