| abstract |
(57) [Summary] [Purpose] Polymaleimide resins, which have better heat resistance than epoxy resins, generally have poor moldability and low strength. The purpose is to improve the properties of this polymaleimide resin as a semiconductor encapsulant. [Structure] The resin composition of the present invention comprises: Polymaleimide, B.I. An allylphenol compound having two or more allyl groups in the molecule, C.I. A polyaminosiloxane having a specific structure, D.I. Silica, E.I. It is characterized in that five components of the organoalkoxysilane compound having an amino group are essential components. [Effect] According to the resin composition containing the above-mentioned five components A to E as essential components, it is possible to obtain a cured product having excellent molding processability, particularly fluidity, and high mechanical strength. Further, the effect of lowering the elastic modulus due to the addition of silica is sufficiently exhibited without lowering the heat resistance, and it is extremely useful as a resin composition for semiconductor encapsulation. |