http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06120659-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
filingDate 1992-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fafbe833382bbc30babb4740273ad3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5a475882a401694bdcd663be4185577
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c9dd112b2729526955413f3a348eda6
publicationDate 1994-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06120659-A
titleOfInvention Multi-layer wiring structure
abstract (57) [Summary] The present invention relates to a first-layer metal wiring formed on a substrate, a first-layer polyimide insulating film for covering the first-layer metal wiring, and the first-layer polyimide. In a multilayer wiring structure including, as a minimum structural unit, a second layer metal wiring connected to the first layer metal wiring through an opening formed in a system insulating film, the substrate has a recess and At least a part of the polyimide-based insulating film is in close contact with the recess, and relates to a multilayer wiring structure. [Effects] According to the present invention, in the multilayer wiring structure, by suppressing the concentration of stress on the peripheral edge portion of the polyimide-based insulating film, and preventing the adhesiveness between the polyimide-based insulating film and the substrate from decreasing, It is possible to prevent peeling from the substrate and cracks accompanying the peeling, and it is possible to stably manufacture a highly reliable multilayer wiring structure.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014232853-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010182973-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1137333-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002280745-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107428146-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170132801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107428146-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013098235-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10798826-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4608794-B2
priorityDate 1992-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 37.