| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 |
| filingDate |
1992-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b48943dce78c01de9f0156187564694
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_febbbd46c9d528168858cf4a3cd85f10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b57bb466845e6d81c85e2b074c7c4587 |
| publicationDate |
1994-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06108182-A |
| titleOfInvention |
Copper alloy |
| abstract |
(57) [Abstract] [Purpose] An object of the present invention is to provide a copper alloy exhibiting high strength and high electrical conductivity as well as excellent workability. [Constitution] 0.1 to 3% by weight of silver is solid-dissolved in a copper matrix, and 0.5 to 6% by volume of dispersed particles are contained therein, and the average diameter of a matrix phase region in which dispersed particles do not exist is 0. .3 μm or less, and when the total amount of solid solution elements other than silver and unavoidable impurities contained in the copper matrix is added to pure copper, the decrease in electrical conductivity is 5% IACS or less. Set to quantity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2406579-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7544259-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004009859-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2406579-B |
| priorityDate |
1992-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |