| abstract |
(57) [Abstract] [Purpose] An object of the present invention is to provide an electrolytic copper plating method capable of sufficiently ensuring the surface smoothness and shape accuracy of a copper plating film. [Composition] When electrolytic copper plating is performed on a metal surface, electrolytic copper plating is first performed using a solution containing sulfate ions and copper ions, and then sulfate ions, copper ions, An electrolytic copper plating method, characterized in that electrolytic copper plating is performed using a solution containing chlorine ions and a surface smoothing agent for the copper plating film. |