http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0598233-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-00 |
| filingDate | 1991-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bf27b15f969ca035ab9b706a455dbe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_864d188d11c29831809137e0c5e37744 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c821969b67a1c4d1983a7c687e70832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545ab069a1d0b17807b024864a9ba908 |
| publicationDate | 1993-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0598233-A |
| titleOfInvention | Film adhesive that can be thermocompression bonded |
| abstract | (57) [Summary] [Structure] An acid component containing 4,4'-oxydiphthalic acid dianhydride (A mole) and another acid dianhydride component (B mole), and a silicone diamine C mole represented by the formula (1): 1] And an amine component containing D moles of another diamine component, silicone diamine or this and 4,4′-oxydiphthalic dianhydride as essential components, and (A + C) / (A + B + C + A thermocompression-bondable film-like adhesive composed of polyimide siloxane in which D) is reacted in the range of 0.5 to 1.0 and (A + B) / (C + D) is in the range of 0.8 to 1.2, and at least 80% or more is imidized. [Effect] Excellent heat resistance, good workability in thermocompression bonding at low temperature, low pressure, and short time, excellent adhesion to metals such as copper and silicon, ceramics, and solder melting not only at room temperature but at 260 ° C It is possible to obtain a film adhesive having sufficient adhesive strength even at temperature. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110337711-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013039029-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110337711-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6261100-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014162801-A |
| priorityDate | 1991-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 150.