http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0597974-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6cfc033f059d282fcd915bc8be2ae53f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04 |
| filingDate | 1991-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99b0c9628abbf353774cb8979d2cf8f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6398bc9eb461cad6f23869e2978286f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81ae7b3c3450004eb65dd63a4f814246 |
| publicationDate | 1993-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0597974-A |
| titleOfInvention | Epoxy resin composition |
| abstract | (57) [Summary] (Modified) [Constitution] Epoxy resin (A) and general formula (1) (Wherein R represents a lower alkyl group, and X 1 and X 2 each independently represent a hydrogen atom, a halogen atom or a lower alkyl group), and the phenolic compound is crosslinked with the bifunctional aromatic residue A resin composition comprising a phenolic resin (B) containing 50% by weight or more of a phenolic resin having the above structure, wherein 0.5 mol of a hydroxyl group of (B) is contained in 1 mol of an epoxy group of (A). An epoxy resin composition of about 1.5 mol. [Effect] The resin composition has a low elastic modulus, a low linear expansion coefficient and a low water absorption coefficient, and also has excellent heat resistance. Furthermore, since it has excellent solder crack resistance and solder moisture resistance, it can be used as a semiconductor sealing material. |
| priorityDate | 1991-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.