| abstract |
(57) [Abstract] [Purpose] A cured product having good fluidity, low expansion coefficient, low stress, and high glass transition temperature, good adhesiveness, and low hygroscopicity is obtained. A thermosetting resin composition suitable as a stopping resin is obtained. [Structure] (a) Naphthalene ring-containing epoxy resin (b) Dicyclopentadiene-modified phenol resin represented by the following general formula (1): (However, in the formula, R 1 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 0 to 15.) (c) An inorganic filler is blended. A semiconductor device is sealed with a cured product of this thermosetting resin composition. |