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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-20
filingDate 1991-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_078cdeb514bca7a093e860d20fc6ae1c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab03137102b9cec8d81aa5cae8167370
publicationDate 1993-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0593177-A
titleOfInvention Adhesive composition for wood
abstract (57) [Abstract] [Purpose] A wood adhesive composition that shortens the heat-bonding time without shortening the usable time of the aminoplast resin adhesive at room temperature. [Structure] 100 parts by weight of aminoplast resin, A wood adhesive composition comprising 0.1 to 20 parts by weight of polyaluminum chloride.
priorityDate 1991-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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