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filingDate 1991-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34b21e373977af93b6502f8c66c08a10
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publicationDate 1993-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0586150-A
titleOfInvention Thermosetting resin composition for in-mold coating molding and coated molding
abstract (57) [Summary] [Structure] A thermosetting resin composition used for in-mold coating molding, comprising a polyamine in a resin component containing the thermosetting resin. [Effect] Polyamine forms an amino group on the surface of the thermosetting resin because a part of the amino group reacts with the thermosetting resin during pressure molding. Since hydrogen bonding between the base material using the thermosetting resin and the resin of the coating molding composition is increased, the adhesion between the base material and the coating layer is improved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9511275-A1
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