http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0570616-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00
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filingDate 1991-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77f166a827f8b89fa4dfbdab533767ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56bc03773cd3141d12360b4f4d5e3277
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publicationDate 1993-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0570616-A
titleOfInvention Method for modifying conductivity of resin molding
abstract (57) [Abstract] [PROBLEMS] To provide a method capable of remarkably improving the electrical conductivity of a resin molded product without impairing the physical properties of the resin molded product and causing no coloring problem. [Structure] The following general formula is used as the raw material of the resin molded body [Wherein Z is an active hydrogen-containing compound residue, Y is an active hydrogen group, k is an integer of 1 to 12, and E is the following general formula: (N is an integer of 0 to 25, R is an alkyl group having 1 to 20 carbon atoms, A unit represented by an aryl group or an alkylaryl group) and a unit B composed of an alkylene oxide Is a copolymer of], the organic polymer compound obtained by cross-linking an organic compound having a skeleton and a complex of an electrolyte salt soluble in these are kneaded, and the kneaded product is molded, and then the resin obtained is obtained. The surface of the molded body is plasma-treated.
priorityDate 1991-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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