| abstract |
(57) [Abstract] [Purpose] To provide a photosensitive resin which has excellent heat resistance and can be developed with an aqueous alkali solution. [Structure] The photosensitive resin of the present invention is an alkali-soluble photosensitive resin that can be produced by reacting an epoxy acrylate compound having a fluorene ring in the molecule with an acid anhydride. The photosensitive resin composition of the present invention is a mixture of the above photosensitive resin with other photopolymerizable non-gaseous ethylenically unsaturated compound, epoxy resin and the like. [Effects] According to the present invention, an alkali-soluble photosensitive resin having excellent heat resistance, adhesion to a substrate, and excellent optical properties such as high transparency and refractive index, and the same are used. An alkali-developable photosensitive resin composition can be obtained and can be suitably used for a solder resist of a printed wiring board, a protective film of a color liquid crystal filter, and the like. |