http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0565658-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36
filingDate 1991-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0568e217ced8191878ea4fe777a6db9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42e1709cc3ee412230ae132289bb5851
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publicationDate 1993-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0565658-A
titleOfInvention Electroless nickel plating solution
abstract (57) [Abstract] [PROBLEMS] To provide an electroless nickel plating solution capable of producing an electroless nickel alloy film having high-temperature heat-resistant non-magnetic properties without decreasing the deposition rate of the nickel alloy film. [Constitution] Nickel salt as a metal ion, malic acid as a complexing agent, hypophosphite as a reducing agent, the concentration of nickel ion is 1.5 to 4.5 g / L, and the molar ratio of malic acid / nickel is An electroless nickel plating solution having a ratio of 3.0 to 5.0.
priorityDate 1991-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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