http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0565421-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_385752f237551ca1b257f160a0f2434b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| filingDate | 1991-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69cf7fbe0e9e94e8f5f61bd167eca99f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b416544808416055b042f66873c03806 |
| publicationDate | 1993-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0565421-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | (57) [Summary] [Purpose] Excellent adhesive strength and mechanical strength not only at room temperature but also at high temperatures, with low metal corrosion and excellent electrical insulation properties, especially suitable for electrical and electronic parts. Provided is a thermosetting resin composition. A thermosetting resin composition is obtained by emulsion polymerization using (a) 30 to 95% by weight of a thermosetting resin and (b) at least a nonionic surfactant as an emulsifier, And, with respect to 100 parts by weight of a polymer component containing 5 to 70% by weight of the copolymer, wherein the monomer unit containing at least a carboxyl group is 1 to 20% by weight of the copolymer, (C) Containing 0.1 to 10 parts by weight of a compound of at least one metal selected from Group II or Group III of the periodic table. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018168281-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9641827-A1 |
| priorityDate | 1991-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 126.