http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0563240-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate | 1991-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2fc5a9eff0868a3d97cdbf8a6876d81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0753945198b475d9e2b805edff734f29 |
| publicationDate | 1993-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0563240-A |
| titleOfInvention | Optical semiconductor device |
| abstract | (57) [Summary] [Structure] The sealing resin layer of the semiconductor element comprises a cured transparent epoxy resin composition containing a transparent epoxy resin as a main component, and 10 to 70% by weight of the entire cured body in the cured body. % Silica particles having a particle diameter of 0.1 μm or less dispersed. [Effect] Since the encapsulating resin layer is excellent in light transmittance and the internal stress is small, for example, in an LED, the luminance deterioration is effectively suppressed, and the reliability becomes extremely high. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005206664-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006241230-A |
| priorityDate | 1991-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.