http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0559140-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-30
filingDate 1991-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13ea52b59e3fa7d47d9106a5d5d7ff8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3caf2e3b61a75bf7cf3790de15520eb
publicationDate 1993-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0559140-A
titleOfInvention Both end allyl group-containing phenol novolak resin and method for producing the same
abstract (57) [Summary]n[Purpose] Low stress, high heat resistance of semiconductor element sealant, It is suitable for use as a silicone flexibilizer that is effective in increasing strength. Silicone-novolak multi-block copolymer Phenol containing both allyl groups required for production Provide novolak resin.n[Constitution] Containing allyl groups at both terminals represented by the following formula [I] Phenol novolac resin (in the formula, R 1 Has 1 carbon atom ~ 4 alkyl groups, R 2 Is an atom having 1 to 4 carbon atoms Represents a rukyl group or an alkoxyl group, and n is a number of 2 or more. is there. ) .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011148854-A
priorityDate 1991-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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