| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
1991-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b262a7c5d9394e4f97df73936f25eedf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_688175a4a9627179a332da81ca9cbc45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97e2f3d571d8e0f7cc17b81a9303fb57 |
| publicationDate |
1993-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0555716-A |
| titleOfInvention |
Flexible wiring board manufacturing method |
| abstract |
(57) [Summary] [Structure] A polyamic acid varnish obtained by mixing a polyamic acid varnish mainly consisting of pyromellitic dianhydride and p-phenylenediamine with a high heat-expandable polyamic acid varnish is directly applied to a metal foil. After that, the solvent is dried and removed, and imidization is performed to produce a flexible wiring board. According to the present invention, it is possible to surely obtain a flexible wiring board made of polyimide and a metal foil, which is significantly improved in thermal expansion coefficient and curl. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006206778-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06283866-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008114579-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006270029-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009235145-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4638893-B2 |
| priorityDate |
1991-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |