http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0551756-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-84
filingDate 1991-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc4e71d810be7865328d632981303443
publicationDate 1993-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0551756-A
titleOfInvention Electroless Ni-P plating method
abstract (57) [Abstract] [Purpose] An object of the present invention is to provide an electroless Ni-P plating method capable of obtaining a plating film without nodules. [Structure] That is, the present invention provides a degreasing process, an acid etching process, a nitric acid dipping process, a first zinc replacement process, a zinc nitrate stripping process, a second zinc replacement process, and an electroless Ni-P process. An electroless Ni-P plating method comprising plating, the acidic etching step, the first zinc replacement step, The cleaning in at least one of the second zinc substitution step is performed by using high frequency ultrasonic waves having an oscillation frequency of 800 to 1200 kHz.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100715635-B1
priorityDate 1991-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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Total number of triples: 20.