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filingDate 1991-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2acdd65242b0b2812128768daa6c449
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publicationDate 1993-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0551431-A
titleOfInvention Liquid epoxy resin composition for semiconductor encapsulation
abstract (57) [Summary] [Purpose] To provide a liquid epoxy resin composition for semiconductor encapsulation, which prevents settling due to crystallization of the resin during storage in a dispenser during the encapsulation resin application process and also has excellent moisture-proof reliability of the package. To do. [Structure] A modified epoxy resin obtained by reacting a biphenol type epoxy resin and a phenol compound in a range of 0.1 to 0.5 hydroxyl groups of the phenol compound per epoxy group of the epoxy resin and a curing agent. Liquid epoxy resin composition for semiconductor encapsulation. [Effect] A resin composition which has excellent dispenser storage stability and excellent moisture resistance reliability, and is useful as an epoxy resin composition for semiconductor encapsulation.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006176732-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003012763-A
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