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filingDate 1991-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c89e4c46f81b3647b1d1b3647e42bb66
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publicationDate 1993-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0547678-A
titleOfInvention Silicon film manufacturing method and silicon film manufacturing apparatus
abstract (57) [Abstract] [Purpose] A polycrystalline silicon film is deposited on a low-temperature substrate at high speed. [Structure] A gas G1 in which silane gas (silicon compound gas) and silicon single crystal fine particles are mixed is introduced from a source gas introduction pipe 5. By the arc discharge generated between the cathode 1 and the anode 4, the argon gas G2 introduced from the inert gas introduction tube 3 is turned into plasma. The gas G1 is mixed with argon plasma, the silane gas (silicon compound gas) is decomposed by the heat of the plasma, and the silicon single crystal fine particles are heated and deposited on the substrate.
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