patent/JP-H0547615-A

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7f61e7e478cafb70907a24ac92903c8
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate	1991-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_997b05d27e09475ec6c83496186ab2c3
publicationDate	1993-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-H0547615-A
titleOfInvention	Semiconductor wafer
abstract	(57) [Abstract] [Purpose] It is intended to provide a semiconductor wafer having a structure capable of being heat-treated without causing film formation defects or thermal strain. [Structure] A through hole is provided in the central portion.
priorityDate	1991-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419510273 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID139340 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518429 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61330 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

Total number of triples: 16.