| abstract |
(57) [Summary] [Purpose] To develop an epoxy resin powder coating for electronic parts coating, which has excellent humidity resistance and thermal shock resistance. A mixture comprising an epoxy resin, a phenol novolac resin represented by the following formula (1) and a bisphenol compound represented by the following formula (2) in a weight ratio of 10/90 to 90/10 and, if necessary, a filler. Epoxy resin powder coating composition (in the formulas (1) and (2), n is a positive integer, R 1 is hydrogen or methyl group, R 2 and R 3 are hydrogen, methyl group, ethyl group or An aryl group, X is -O -, - respectively a - S-, or -SO 2. n is 1 or 2, and R 2 and R 3 may be the same or different. ) [Chemical 1] |