http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0536742-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5198a2a21392d6cbc0bb4898b3fb3d29 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-395 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate | 1991-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c981922b7366ea27e3f680dc8566a59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bee39609dfd560f40428efcf3e992700 |
| publicationDate | 1993-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0536742-A |
| titleOfInvention | Resin encapsulation method for electronic parts |
| abstract | (57) [Summary] [Object] To provide a resin encapsulation method for an electronic component, which can reduce the stress generated in the encapsulation resin. [Structure] High voltage IC 14 and partition jig 30 Is attached and the high voltage IC 14 is divided into a plurality of blocks. The partition jig 30 is a high voltage IC1 It is composed of a partition plate 32 for partitioning 4 and a support plate 34 for supporting the partition plate 32, and is made of Teflon. In order to seal the high voltage IC 14 with resin, the epoxy resin 24 is first potted for each block. After heating to cure the resin 24, the partition jig 30 is removed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007335690-A |
| priorityDate | 1991-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14917 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559562 |
Total number of triples: 19.