| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c10e1e222f10a69411e659d01c18b83 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 |
| filingDate |
1992-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95233a5583ffab6a849d3a33fec8fa52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59b18efa9b9c4158982f231e2fe6a40e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6592ae9a00f05e9ae5ae1e74af3207db |
| publicationDate |
1993-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H05331654-A |
| titleOfInvention |
High hardness electroless nickel-boron plating solution and plating method using the same |
| abstract |
(57) [Summary] [PROBLEMS] To provide an electroless nickel-boron plating solution and a method for electroless nickel-boron plating that can obtain high hardness without high temperature treatment. [Constitution] Electroless nickel containing nickel ion, boron-based reducing agent, borate ion and ammonium ion Boron plating solution. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006257460-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007314876-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000239852-A |
| priorityDate |
1992-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |