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filingDate 1992-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43a0ac9627f39fb4aaf5c5f56ce49479
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publicationDate 1993-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05331446-A
titleOfInvention High molecular weight polyimide resin film adhesive
abstract (57) [Summary] [Structure] When the glass transition temperature of a polyimide resin obtained by using silicone diamine as an essential amine component is defined as Tg and the glass transition temperature of the polyimide resin is T (° C), a time (hr) represented by the following formula (hr ) T A film adhesive whose main component is a polyimide resin obtained by heat treatment. 0.01 × (Tg-T) × log (12) + log (96)> log (t)> 0.05 × (Tg-T) × log (6) + log (8) Tg + 120 ≧ T ≧ Tg−35 [Effect] Low boiling point It is possible to obtain a film adhesive with excellent properties by subjecting a completely imidized polyimide resin of a specific structure, which is soluble in organic solvent, to a high molecular weight by heat treatment in a solid state, and it is industrially available as an electronic material. Very useful for
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