| abstract |
(57) [Abstract] [Purpose] To provide a resin composition for semiconductor encapsulation having excellent heat resistance and crack resistance. [Structure] (a) Polymaleimide compound having a specific structure, (b) Phenol compound having a specific structure, (c) Epoxy compound having two or more epoxy groups in the molecule, (d) Silicone Rubber particles, and (E) A resin composition containing an inorganic filler mainly composed of crushed and / or spherical fused silica powder. [Effect] It is suitable for semiconductor encapsulation with excellent solder crack resistance. |