http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05325693-A

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filingDate 1992-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_844940e6951cbd2092f79db5d9a3925f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ff4697ae6cbd7fab3e81f7cd0029d50
publicationDate 1993-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05325693-A
titleOfInvention Method for manufacturing heat-resistant thin paper
abstract (57) [Summary] [Purpose] Excellent absorption and impregnation of electrically negative gas, silicon oil, resin, etc., which is composed mainly of pulp and short fibers made of aramid-based polymer, and good electrical characteristics. A heat-resistant thin paper sheet is provided. [Structure] 1 to 20% by weight of aromatic polyamide pulp, A heat-resistant thin paper obtained by heat-pressurizing a wet paper formed by a wet papermaking method from an aqueous slurry consisting essentially of a mixture of 99% to 80% by weight of aromatic polyamide short fibers. The amount of the polar solvent contained in the aromatic polyamide pulp in the thin paper before (calendering) is in the range of 0.013 to 5.50%, and the thin paper after heat-pressing (calendering) Basis weight is 8 ~ 45 g / m 2 range, bulk density 0.20-0.90 g / A method for producing a heat-resistant thin paper characterized in that it is within a cm 3 range.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007109671-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102930978-A
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